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Flip chip, also known as controlled collapse chip connection or its acronym, C4,〔E. J. Rymaszewski, J. L. Walsh, and G. W. Leehan, "Semiconductor Logic Technology in IBM" ''IBM Journal of Research and Development'', 25, no. 5 (September 1981): 605.〕 is a method for interconnecting semiconductor devices, such as IC chips and microelectromechanical systems (MEMS), to external circuitry with solder bumps that have been deposited onto the chip pads. The solder bumps are deposited on the chip pads on the top side of the wafer during the final wafer processing step. In order to mount the chip to external circuitry (e.g., a circuit board or another chip or wafer), it is flipped over so that its top side faces down, and aligned so that its pads align with matching pads on the external circuit, and then the solder is reflowed to complete the interconnect. This is in contrast to wire bonding, in which the chip is mounted upright and wires are used to interconnect the chip pads to external circuitry.〔Peter Elenius and Lee Levine, Chip Scale Review. “(Comparing Flip-Chip and Wire-Bond Interconnection Technologies ).” July/August 2000. Retrieved July 30, 2015.〕 ==Process steps== #Integrated circuits are created on the wafer #Pads are metalized on the surface of the chips #Solder dots are deposited on each of the pads #Chips are cut #Chips are flipped and positioned so that the solder balls are facing the connectors on the external circuitry #Solder balls are then remelted (typically using hot air reflow) #Mounted chip is “underfilled” using an electrically-insulating adhesive Image:Flip chip pads.svg Image:Flip chip bumps.svg Image:Flip chip flipped.svg Image:Flip chip mount 1.svg Image:Flip chip mount 2.svg Image:Flip chip mount 3.svg Image:Flip chip mount underfill.svg Image:Flip chip mount final.svg 抄文引用元・出典: フリー百科事典『 ウィキペディア（Wikipedia）』 ■ウィキペディアで「Flip chip」の詳細全文を読む スポンサード リンク
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